Aftermarket Cooling Difficulties

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How do I safely peel off the Kingston OEM heat sinks from my 3GB 2000MHz DDR3 Non-ECC CL9 (9-9-9) DIMM (Kit of 3) Intel XMP ?

What is the adhesive used to bond the heat sink to the chips?

What is the best method to defeat the adhesive, like hot-air gun heat for hotmelt glue?

Removing the clips was easy, I just slid a paint-scraping razor blade underneath each end of the clip (just up to against the lugs) and the clip slipped right off.

Using my finger nails I tried to pry apart the heatsinks by pulling only at the two plates, allowing the card to be untouched.

All as I managed to do was warp the ends of the heat sinks and at that point I feared the bond of the chips to the card might be weaker than the bond of the heat sink to the chips and that should I apply more force I'll rip the chips off the card.

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Lacking any suggestions from this BBS.

I used a plastic Id. card and sliced through the adhesive along one side of the card and gently peeled up the heat spreader.

One hinge readily disengaged.

I used a small flat blade screwdriver to tweak the other hing so that the tab would slid out of its slot.

I then sliced off the remaining heat spreader.

I then used my finger nail to clean all the residue off the tops of the chips.

I used the plastic Id. card to scrape down the back side of the card as its only a single sided stick.

There was a slightly tacky film left on the back side of the stick and I left it alone.

I hope this helps someone else.