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Thread: Mushkin's Introduces New Heat Spreaders

  1. #1
    Darthtanion's Avatar
    Darthtanion is offline Senior Member
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    Default Mushkin's Introduces New Heat Spreaders

    With memory modules that are warranted to at least 2.9v and the ability to hit upwards of 3.6v and beyond, anything that addresses better cooling is a huge benefit. Mushkin has taken the bull by the horns and done something to improve on a winning concept, namely better heat spreaders on all it's Redline product line. According to Mushkin, this will not affect price at all, just the better cooling potential.

    Here's the official PR:

    Mushkin Announces New Heatsink Design for High Performance PC’s

    Denver, CO, July 28, 2005-Mushkin announces a new heatsink for high performance DRAM memory modules. The new heatsink is designed to handle the increased thermal demands of today's high performance PCs. The new design delivers superior thermal conductivity and dissipation. It's sleek and aero-efficient design provides 58% more surface area than Mushkin’s previous heatsink.

    "By opening up the design we improved airflow in and around the memory module and increased the surface area," says Brian Flood, head of Mushkin's product development. "It's far superior in performance and appearance."


    Additionally, the new design utilizes an advanced thermal adhesive with double the thermal conductivity of the previous material. Mushkin is using the new heatsink on all its performance DDR and DDR2 products, such as the Redline series products that benefit the most from the new design, like the popular Redline and Xtreme series products. Expect to see the new heatsink on all Mushkin performance DDR products.
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    Yawgm0th's Avatar
    Yawgm0th is offline Senior Member
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    Default Re: Mushkin's Introduces New Heat Spreaders

    This is actually quite necessary as Red Line and OCZ VX both need some extra (even active) cooling when you get them around 3.3v-3.6v, which is what they need in order to be taken advantage of.

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