Re: Have a really amazing invention, how do I contact Microsoft to pitch it to them?
TBH, most if not all NB and SB chipsets don't produce enough heat to warrant huge coolers and fans.
Even if one did fit larger sinks and fans, the heat they dissipated would still be dumped into the case, unfortunately. Unless severely over volted, your NB, SB and MOSFETs will be fine really. OFC, if water cooling, then WC on the NB and FETS may as well be done, it's an enthusiast thing. It also means that minimal case air flow is then needed. The SB definitely doesn't need beefier cooling. I'd bet everyone on a modern SB could easily remove their current heatsink and it's run almost at the same temp.
Those large looking sinks on some of the new P55 and the X58's are the size they are because they are also cooling auxilliary SATA, PCIE bridges etc.
For the multi CPU thing, I suppose they could go back to slotted CPU's and rather than the slot part being part of the CPU, have it come with the mobo with say 4 CPU sockets on it. The board to card connector could be similar to a PCI/PCIE card's contacts but obviously there'd be many more of them and the slot would have to be a direct connection for decent bandwidth.
Problem is that everything in a PC conforms to some kind of standard. Everything has to be ratified, from form factors to sockets to PCIe and USB to PSU ATX levels etc. There's actually a lot less flexibility than one would think.
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